microelectronics and semiconductors
A key challenge for manufacturers of flexible printed circuit boards (FPCBs) for the burgeoning portable electronic device industry lies in the ability to process small, flexible circuit boards, which are extremely heat sensitive.
Powerlase Photonics has developed unique processes for flexible PCB singulation and via drilling. It is currently working with a selection of multinational organisations based in Asia to develop next generation flexible PCBs.
The Powerlase photonics range of lasers, including high power 532nm systems, have proven applications in silicon processing, device separation, patterning of multi-chip module substrates, and the cutting of flexible copper laminate PCB material.
Powerlase photonics is working with world leading technology partners to successfully address the needs of next generation lithography in the semiconductor industry via the use of its lasers for the production of Laser Produced Plasmas (LPP) and Discharge Produced Plasmas (DPP) for the creation of Extreme Ultra Violet (EUV) light.