microelectronics and semiconductors

A key challenge for manufacturers of flexible printed circuit boards (FPCBs) for the burgeoning portable electronic device industry lies in the ability to process small, flexible circuit boards, which are extremely heat sensitive.

POWERLASE has developed unique processes for flexible PCB singulation and via drilling. It is currently working with a selection of multinational organisations based in Asia to develop next generation flexible PCBs.

The POWERLASE range of lasers, including high power 532nm systems, have proven applications in silicon processing, device separation, patterning of multi-chip module substrates, and the cutting of flexible copper laminate PCB material.

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